interconnect solution
high-frequency high-speed seri
other solutions
features:
•ceramic/ptfe microwave composite
•lowest insertion loss in class
•“best-in-class” loss tangent (0.0010)
•electrical phase stability vs.
temperature
•high thermal conductivity
•tightest dielectric constant (±0.03) and thickness tolerance
benefits:
•excellent thermal stability of dk and df
•phase stability vs. temperature
•high degree of dimensional
stability required for complex,
multi-layer boards
•excellent cte in x,y and z directions
typical applications:
•defense microwave/rf applications
•radar
•phase fed array antennas
•microwave feed networks
•cni (communication, navigation and identification) applications
•sigint, satellite & space electronics
•other high frequency and high speed applications
corporate responsibility
