interconnect solution
high-frequency high-speed seri
other solutions
features and benefits:
•low dielectric loss(0.0013 @10ghz)
•excellent mechanical properties vs. temperature
•reliable strip line and multi-layer board constructions
•suitable for use with epoxy glass multilayer board hybrid designs
•stable dielectric constant vs.
temperature and frequency
•suitable for applications sensitive to
temperature change
•excellent dimensional stability
typical applications:
•automotive radar applications
•global positioning satellite antennas
•cellular telecommunications systems -power amplifiers and antennas
•patch antenna for wireless
communications
•direct broadcast satellites
•datalink on cable systems
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