interconnect solution
high-frequency high-speed seri
other solutions
interconnect solution
high-frequency high-speed seri
other solutions
interconnect solution
high-frequency high-speed seri
other solutions
features:
•excellent thermal coefficient of dielectric constant
•excellent pim performance
•high thermal conductivity ideal for higher power designs.
•reduced coefficient of thermal
expansion in z-direction (ctez)
•tightest commercial laminate dk tolerance for impedance control
benefits:
•low dielectric loss (loss tangent)
•low insertion loss (s21)
•excellent electrical phase
stability vs. temperature
•excellent copper bond strength
•low water absorption
typical applications:
•base station antennas
•power amplifiers (pa), tower mounted amplifiers (tma) and tower mounted booster amplifiers (tmb)
•antenna feed networks
•rf passive components
•multimedia transmission systems
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