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interconnect solution
high-frequency high-speed seri
other solutions
interconnect solution
high-frequency high-speed seri
other solutions
interconnect solution
high-frequency high-speed seri
other solutions
features and benefits:
•low dielectric constant ( @10ghz dk 3.20)and dissipation (@10ghz df 0.0030)
•high glass transition temperature(tg 280℃)
•low press temperature 180℃
•reliable multiple press characteristics
•good blind hole filling effect
•excellent thickness uniformity
typical applications:
•radar
•antennas
•rf couplers
•filter
•passive components
•power amplifier
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